株式会社日立功率半导体

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650V~

  • High speed, low loss IGBT module
  • Low thermal impedance due to direct liquid cooling
  • High reliability, high durability module
Package Type Name
(Update)
Vce(V) IC(A) Feature Status*1 Application Note Outline Step file
6in1 IGBT 750 500   M  
750 900   M  
*1
M:Mass production, W:Working sample, U:Under development, S:Under Study, D:Discontinued

1200V

  • High speed, low loss IGBT module.
  • Low driving power: Low input capacitance advanced IGBT.
  • Low thermal impedance due to direct liquid cooling.
  • High reliability, high durability module.
  • Temperature sensor on IGBT.
Package Type Name
(Update)
IC(A) Feature Status*1 Application Note Outline Step file
6in1 IGBT 400   W  
*1
M:Mass production, W:Working sample, U:Under development, S:Under Study, D:Discontinued

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