株式会社日立功率半导体

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Hitachi

株式会社日立功率半导体

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650V~

  • High speed, low loss IGBT module
  • Low thermal impedance due to direct liquid cooling
  • High reliability, high durability module
Package Type Name
(Update)
Vce(V) IC(A) Feature Status*1 Application Note Outline Step file
6in1 IGBT 650 600   M  
700 800   M    
750 500   U    
MBB900TX7B 750 900   S    
*1
M:Mass production, W:Working sample, U:Under development, S:Under Study, D:Discontinued

依据贵公司的要求,可以提供MBB600TV6A、MBB800TV7A的测试组件(收费)。
详情请咨询销售代表窗口
①驱动板 ②水冷槽 ③密封圈(O-ring)

1200V

  • High speed, low loss IGBT module.
  • Low driving power: Low input capacitance advanced IGBT.
  • Low thermal impedance due to direct liquid cooling.
  • High reliability, high durability module.
  • Temperature sensor on IGBT.
Package Type Name
(Update)
IC(A) Feature Status*1 Application Note Outline Step file
6in1 IGBT 400   U    
*1
M:Mass production, W:Working sample, U:Under development, S:Under Study, D:Discontinued

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